High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness Φ150 mm Single spindle Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification Single-axis dicing ...

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces Φ200 mm Single spindle High processability Adoption of a 1.8 kW high-output spindle enables the processing ...

Flexibility for diverse processing needs Φ200 mm Single spindle Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...

Φ300 mm manual dicer to meet a variety of needs Φ300 mm Single spindle Exceptional processing flexibility While offering an even more compact footprint than the existing ...