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ZHRF
Product Classification

ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
zhdg1
zhdg2
Product Classification

ZHDG Series

Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHFX1_SERIES
Product Classification

ZHZZ Series

Ultrathin hub blades for stable dicing of narrow street wafers Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc ZHZZ series hub blades were ...
ZHFX1_SERIES
Product Classification

ZHFX Series

Achieves continuous, high-quality processing of oxide wafers Electroformed bond Applications: Oxide wafers (LiTaO3, etc.), etc The ZHFX Series employs a bond that has ideal wear properties for ...
zhcrseries
Product Classification

ZHCR Series

Provides stable processing through increased blade edge deformation resistance Electroformed bond Applications: Silicon wafer, etc For relatively thick blades in excess of 60 ...
ZH14SERIES
Product Classification

ZH14 Series

Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions Electroformed bond Applications: Silicon wafer, Compound ...
ZH05SERIES
Product Classification

ZH05 Series

Provides stable processing through high-accuracy concentration control Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
stayclean-A
Product Classification

StayClean-A

Prevents particle adhesion during dicing Cutting water additive to prevent particle adhesion Particle adhesion is a ...
stayclean-F
Product Classification

StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
nbc-zh
Product Classification

NBC-ZH Series

Achieves high productivity and superb dicing results through excellent dicing performance and long life Electroformed bond Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
Blade breakage sensor6
Product Classification

Blade breakage sensor

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

cc_filter
Product Classification

CC Filter Unit

Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...
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