Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...

Advanced resistivity control technology eliminates electrostatic charge in high-purity water. Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...

Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.

Higher Dicing quality with lower environmental impact Support for dicing quality The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

Spin cleaning and drying for workpieces processed using dicing saws Manual cleaning system with enhanced cleaning performance The DCS1441 is the optimal solution for cleaning and ...

Prevents particle adhesion during dicing Cutting water additive to prevent particle adhesion Particle adhesion is a ...