Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...

Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface ...

Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

You can select a manual wafer mounter from a wide range of models to meet a variety of needs, from research and development to semi-custom production. This manual wafer mounter series supports three different sizes of ...

This wafer mounter is ideal for diversified tape application and lamination conditions. This model meets user requirements for manual equipment that is automated for only critical application work and that allows for ...

FM-903 is normal type semi-automatic wafer mounter up to 8 inch(200mm) size of work. Automatic operation means the operator is required only for loading and unloading workpieces. This contributes to stable tape and ...

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...