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ZP07 Series
High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...
The ZP07 series realizes high-grade processing of hard ...
ZHZZ Series
Ultrathin hub blades for stable dicing of narrow street wafers
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), etc
ZHZZ series hub blades were ...
ZHRF Series
Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 ...
ZHFX Series
Achieves continuous, high-quality processing of oxide wafers
Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc
The ZHFX Series employs a bond that has ideal wear properties for ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
Z09 Series
Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
The Z09 series adopts a newly developed high strength bond and meets ...
Z05 Series
Ultra-high cutting performance for diverse applications.
The Z05 Series offers ultra-high cutting performance for a wide range of ...
The Z05 Series offers ultra-high cutting performance for a wide range of ...
VT07/12 Series
Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
UVC-408 for 8”
High- pressure Mercury lamp models which have perfect UV curing
performances is 200mm (8”) manual and 300mm (12”) manual
system.
UVC-300
Model: UVC-300A for up to 12”
UV-LED models which have a long life and low running cost are
cassette to cassette fully automatic system and 200mm (8”) manual
and 300mm (12”)
UVB-608i for up to 8"
Black-light type UVB-608i
UVB-608i is adopted black-light fluorescent lamp and designed minimal specification for
exceptional cost-performance value.
Ultrasonic-wave dicing unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
UltraPoligrind
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
TM11 Series
Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
TEX-218G
TEX-218G for up to GR-8
The TEX series is adopted air cylinder for expansion stage operation. It makes
equipment component become simple and realized easy maintenance.
Super Bubbler Wac
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
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