Taiko is derived from one of the Japanese drum. Taiko process leaves about 2 mm ungrinded from wafer circumference. Around 195mm on 8” wafer is thinned while 140mm on 6” wafer. This process reduces warpage and the risk of breakage due to thin wafer handling.

Applicable grinder machine is DISCO’s DAG810. Please click on Catalogue for more technical details about the machine….

Cataloque