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DFG 8540
Fully Automatic Grinder
A fully-automatic wafer backgrinder that can process up to 8" size of wafer. It has 2 spindles, 3 chuck table, 1 turn table design.
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DFG 8560
Fully Automatic Grinder
A fuly-automatic wafer backgrinder that can process up to 12" size of wafer. It has 2 spindles, 3 chuck table, 1 turn table design.
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DFG8540 PLUS LTD 2500/F8
8" DBG System
The DBG In-line System performs grooving, die separation, dicing frame mounting, and protective tape peeling in one smooth process using a special Disco DBG grinder and Lintec Corporation-made DBG mounter.
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DFG856O PLUS LTD 2500/F12
12" DBG System
The DBG In-line System performs grooving, die separation, dicing frame mounting, and protective tape peeling in one smooth process using a special Disco DBG grinder and Lintec Corporation-made DBG mounter.
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DGP 8760
12" Fully Automatic Grinder With Polisher
The 8760 Grinder/Polisher performs loading, grinding, polishing, cleaning and drying, and unloading with just the touch of a button.
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DFL 7160
Fully Automatic Laser Saw
The 7160 Laser Saw performs loading, alignment, laser processing, cleaning and drying, and unloading with just the touch of a button.
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DTU 1531
Water Temperature Controller Unit
These units provide both spindle coolant and wheel coolant at a stable temperature and pressure.
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DTU 152
Water Temperature Controller Unit
These units provide both spindle coolant and wheel coolant at a stable temperature and pressure.
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DTU 162
Water Temperature Controller Unit
These units provide both spindle coolant and wheel coolant at a stable temperature and pressure.
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TAIKO GRINDING
NEW
TAIKO Grinding
Taiko is derived from one of the Japanese drum.
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DFS8910
NEW
DISCO Fully Automatic Surface Planar
The DFS8910 lowers connection defects by planarizing Au bumps on LCD drives and makes the bumps dimple-less.From loading a wafer, washing it after processing and up through unloading it back into the cassette, all wafer handling is automatic. Furthermore, the DFS8910 supports processing of resin and ductile metals (gold, copper, and aluminum), and attains high-level planarization.
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