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| Dicing Saw |
Disco Corporation |
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DAD 3350
Semi-automatic Wafer Saw
DAD3350 features a 1.8 kW spindle for excellent cutting results and a highly rigid bridge-type frame structure for excellent process stability.
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DAD 3220
Semi-automatic Wafer Saw
DAD3220 is extremely compact. With a footprint approximately 14% smaller than that of predecessor DAD321.
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DAD 3230
Semi-automatic Wafer Saw
DAD3230 features an expandable design ideal for customization.
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DAD 3430
Semi-automatic Wafer Saw
DAD3430 , based upon the DAD3230 design, is an ultra-high-precision dicing saw with an air slide on the X-axis.
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DFD 6240
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6340
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6450
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6361
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DCS 141
Automatic Wafer Cleaning Unit
The spinner unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces.
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DAD3350
NEW
(Ultrasonic Spindle) Dicing Saw
Dicing with ultrasonic technology has been developed as a new application to support the processing of electronic components (ceramic parts) and optical devices (optical disc parts, optical transmission parts). Using ultrasonic technology will enable the processing of materials such as glass and ceramics, which until now have been difficult to cut with a blade. Applicable machine is DAD3350.
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