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| Singulation Machine |
Disco Corporation |
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DAD 3350
Semi-automatic Wafer Saw
DAD3350 features a 1.8 kW spindle for excellent cutting results and a highly rigid bridge-type frame structure for excellent process stability.
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DAD 3220
Semi-automatic Wafer Saw
DAD3220 is extremely compact. With a footprint approximately 14% smaller than that of predecessor DAD321.
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DAD 3230
Semi-automatic Wafer Saw
DAD3230 features an expandable design ideal for customization.
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DAD 3430
Semi-automatic Wafer Saw
DAD3430 , based upon the DAD3230 design, is an ultra-high-precision dicing saw with an air slide on the X-axis.
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DFD 6240
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6340
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6450
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DFD 6361
Fully Automatic Wafer Saw
The 6000 series saws perform loading, alignment, cutting, cleaning and drying, and unloading with just the touch of a button.
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DCS 141
Automatic Wafer Cleaning Unit
The spinner unit cleans semiconductor wafers, glass, ceramics, and a wide variety of other workpieces.
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