Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...