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DAD322026
Product Classification

DAD3220

Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness Φ150 mm Single spindle Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification Single-axis dicing ...
DAD3236
Product Classification

DAD323

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...
DAD3230
Product Classification

DAD3230

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification Single-axis ...
DISCO-DAD32409
Product Classification

DAD3240

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces Φ200 mm Single spindle High processability Adoption of a 1.8 kW high-output spindle enables the processing ...
DISCO-DAD3350
Product Classification

DAD3350

Flexibility for diverse processing needs Φ200 mm Single spindle Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DISCO-DAD3360
Product Classification

DAD3360

Φ300 mm manual dicer to meet a variety of needs Φ300 mm Single spindle Exceptional processing flexibility While offering an even more compact footprint than the existing ...
DAD3430
Product Classification

DAD3430

Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DISCO-DAD3650
Product Classification

DAD3650

Ultra compact dual-spindle automatic dicing saw Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DISCO-DAD3660
Product Classification

DAD3660

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...
DDS2010
Product Classification

DDS2010

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...
DDS2300
Product Classification

DDS2300

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...
disco_DFD6240
Product Classification

DFD6240

Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...
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