Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3651 combines high ...
Adopted an air slide on the X-axis to support high precision processing needs
Φ150 mm
Single spindle
Able to support wide range of applications
Supports workpieces up to Φ6-inch ...
Highly expandability to support various processing needs
Φ300 mm
Single spindle
Supports a wide range of applications
DAD3361 is a semi-automatic dicing saw capable of handling ...
Standard manual dicing saw for Φ8-inch workpieces
Φ200 mm
Single spindle
High processability
Improved throughput through the introduction of servo motors on all axes (X, Y, and ...
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Focus on Functionality and Expandability
DAD3231, designed for high performance and expandability, just like the conventional ...
Evolved Compact Dicing Saw
Φ150 mm
Single spindle
Compatible with Diverse Small Workpiece Processing Needs
DAD3221 is a single-axis dicing saw which achieves processing of ...
Φ6-inch Compact Dicing Saw which Achieves World’s Smallest Footprint while Improving Functionality
Φ150 mm
Single spindle
Support for a variety of applications from semiconductor wafers to ...
Advanced performance for Φ300 mm dicing
Φ300 mm Facing dual spindle DBG
Enhanced dicing throughput
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual ...
Standard dual spindle dicing saw
Φ200 mm Facing dual spindle DBG Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration ...
A space-saving solution for Φ300 mm dicing
Φ300 mm
Facing dual spindle
Space-saving layout
DFD6561 is equipped with uniquely developed short spindles and an optimized bridge-type ...