High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...