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DDS2010
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
DDS2300
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
Disco-DAW4110
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
Disco-DDS2310
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...
GF01 SERIES
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
GF13 Series
GRINDING WHEELS
Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
•Supports SDBG ...
IF SERIES
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
Poligrind
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
UltraPoligrind
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
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- +63 998 961 9440
- info@aurotech.com
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