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Blade breakage sensor6
Product Classification

Blade breakage sensor

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

cc_filter
Product Classification

CC Filter Unit

Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...
C02_injector
Product Classification

CO 2 Injector

High quality processing through direct link to dicing saw Workpiece charging significantly reduced The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
dcs1440priod
Product Classification

DCS1440

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
1441
Product Classification

DCS1441

Spin cleaning and drying for workpieces processed using dicing saws Manual cleaning system with enhanced cleaning performance The DCS1441 is the optimal solution for cleaning and ...
DCS1460
Product Classification

DCS1460

Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DDS2010
Product Classification

DDS2010

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...
DDS2300
Product Classification

DDS2300

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...
DAW4110
Product Classification

Disco-DAW4110

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...
2310
Product Classification

Disco-DDS2310

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...
DTU1550
Product Classification

DTU1550

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...
DTU162
Product Classification

DTU162

Higher Dicing quality with lower environmental impact Support for dicing quality The DTU162 keeps both spindle cooling water and cutting water at a constant temperature and suitable ...
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