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DFG8830
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DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
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DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
8761
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DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
mitsui 1
mitsue
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ICROS™ Tape

“ICROS™ Tape has been the world's top protective tape used in semiconductor wafer backgrinding (BG) for many decades. In order to meet the strict requirements of the semiconductor market, we optimize the whole ...

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