Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces ...
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
Supports small volume grinding with high precisio
Φ200 mm
1 axis, 2 chuck tables
Stable, high-precision wafer processing
With the integration of devices, wafer manufacturing ...
Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield ...
Supports advancements for thinner and larger wafers
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is ...
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...
Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...