Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Ultra compact dual-spindle automatic dicing saw Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness ...

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...

Φ300 mm manual dicer to meet a variety of needs Φ300 mm Single spindle Exceptional processing flexibility While offering an even more compact footprint than the existing ...

Evolved Compact Dicing Saw Φ150 mm Single spindle Focus on Functionality and Expandability DAD3231, designed for high performance and expandability, just like the conventional ...

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...

Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification Single-axis ...

Highly expandability to support various processing needs Φ300 mm Single spindle Supports a wide range of applications DAD3361 is a semi-automatic dicing saw capable of handling ...