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IF SERIES
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
Non contact setup
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
Poligrind
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Applications: Silicon wafer, etc Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
StayClean Injector
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
StayClean-A
Prevents particle adhesion during dicing
Cutting water additive to prevent particle adhesion
Particle adhesion is a ...
StayClean-F
Prevents pad corrosion during dicing
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
StayClean-R
Conserving Water While Preventing Corrosion
Prevents Corrosionby DI water
The active component in StayClean-R continuously ...
Super Bubbler Wac
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
UltraPoligrind
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Ultrasonic-wave dicing unit
Realizes high quality and high speed processing of difficult-to-cut materials
Targets for ultrasonic-wave processing
Ultrasonic-wave processing aims to achieve good processing ...
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- +63-(49)-5012436
- +63 908 887 4217
- +63 998 961 9440
- info@aurotech.com
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