Ultracompact DI water recycling unit with extraordinary energy and water conservationNumerous functions, ultra compact
The DWR1722 is a DI water recycling unit for dicing saws ...
Unique filter design for low filtration running costsDesigned for use next to a dicing saw Ultra-small footprint filtration system
This unit recycles dicing/grinding water and ...
Dedicated unit for injecting StayClean into cutting water
Highly accurate dilution control to ratios as low as 1:10,000.
• Automatic bottle replacement enables continuous ...
Prevents pad corrosion during dicingPad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Next generation water temperature control unit which has improved cooling efficiency and water supply capacityStable High Precision Processing
DTU1550 is a water supply unit for ...
Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance
The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
Blade tip position relative to the chuck table surface is detected by an optical sensor. Processing quality is stable since the blade wear can be measured at any time during processing.
Advanced resistivity control technology eliminates electrostatic charge in high-purity water.
Rinse water resistivity can be controlled in the best condition at the dicing process of semiconductor industries or high ...
Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance
The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...