Intuitive operation
The LCD panel allows touch operation of the alignment teach function. Important data, such as the equipment condition and mean time between assists (MTBA) is also displayed on the screen, allowing the operator to easily confirm the status of the equipment. Onscreen error recovery assistance is also available.

High-rigidity spindle
Adoption of high rigidity spindle achieves increased processing stability.

Non-contact setup
The NCS (Non-Contact Setup) measures the blade wear amount with high accuracy and speed.

Synchronized dicing axis (X, Y, and Z) control
Measures the height of the chuck table to which the wafer will be secured in advance and controls the blade cutting depth with high accuracy (user-specified).

Options for particle prevention
Users can select optional particle prevention measures used in other models, such as the cut section atomizing nozzle and spinner atomizing nozzle. A chuck table water curtain, which prevents particle adhesion caused by wafer drying, is also available.

Concentrated maintenance area
All operations, from routine to maintenance, can be performed from the front of the equipment. The space reduction achieved in the DFD6561 allows 5 units to be lined up in a space which would only fit 4 units for the DFD6362 at a production facility.

 *Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.