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DP-F05 Series
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo
ultra
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

UltraPoligrind

Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
IF_SERIES
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

IF SERIES

High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The IF Series in-feed grinding ...
ZHRF
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

ZHRF Series

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...
gf01_series
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

GF01 SERIES

Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc The newly developed GF01 Series in-feed grinding wheels ...
Gettering DP
Gettering DP1
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
DP08
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
GF136
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

GF13 Series

GRINDING WHEELS Improved productivity and grinding quality Grinding wheel for semiconductor wafer
•Supports SDBG ...
tm11series
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
zp07_1
zp07_2
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

ZP07 Series

High grade processing is possible with an electroplated porous structure blade
The ZP07 series realizes high-grade processing of hard ...
b1_a
b1
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
z09
Product Classification
Consumable Nessun costo aggiuntivo
  • Consumable Nessun costo aggiuntivo

Z09 Series

Electroformed blades with higher strength and variety of oncentration
The Z09 series adopts a newly developed high strength bond and meets ...
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