Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

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High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...

Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification Single-axis ...

Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces Φ200 mm Single spindle High processability Adoption of a 1.8 kW high-output spindle enables the processing ...

Φ300 mm manual dicer to meet a variety of needs Φ300 mm Single spindle Exceptional processing flexibility While offering an even more compact footprint than the existing ...

Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing Φ150 mm Single spindle Compatible with 6 x 6-inch Workpieces Using a User-Specified ...