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DAS8920
Semi-automatic surface planer for Φ8-inch wafers
Φ200 mm
1 axis, 1 chuck table
Planarization
Ultrahigh-precision planarization technology using a diamond bit
The DISCO surface ...
DAS8930
Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8910
Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8960
Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DP08 Series
Chemical-free stress relief dry polishing wheel|
In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
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