Chemical-and slurry-free stress relief
Improved yield Relieve wafer stress without slurry, chemicals or water. The DFP8140/8160 effectively removes ...

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...

Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces ...

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off

• Laser Lift-off is a technology used to detach the material layer from the ...

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT

• DFL7341 is a fully automatic laser saw for Φ8-inch ...

Supports various applications, including full cut and DAF cut Φ300 mm Ablation

• DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

High end dicing saw for Φ300 mm wafers Φ300 mm Facing dual spindle Fully automatic dicing saw with dual chuck tables DFD6760 is a high end model which has further enhanced ...

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...