The only product in the market offering an in-line strip-to-strip die bonder solution. The ADAT3 XF DBS receives strips directly from one machine, processes them, and feeds them to the next — maximizing your productivity. Handling ultra-small and medium die at unparalleled speed, it easily connects to top and bottom screen-print equipment. This die bonder is also equipped with automated wafer change and high-definition optics for on-the-fly quality inspection.