Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Automatic grinder to respond to new processing needs Φ200 mm 1 axis, 1 chuck table Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces ...

Ablation Process A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting. • Little to no heat damage to the workpiece. • ...

Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...

Spin cleaning and drying for workpieces processed using dicing saws Manual cleaning system with enhanced cleaning performance The DCS1441 is the optimal solution for cleaning and ...

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...

Among the world’s smallest fully automatic dicing saws Φ200 mm       Single spindle Factory-friendly design By optimizing the frame structure and handling section layout, the ...

Dicing saw for improved productivity with Φ300 mm wafers Φ300 mm     Facing dual spindle Realizes further productivity improvement with various new functions DFD6362 offers a ...

Fully automatic dicing saw with parallel dual spindles Φ200 mm Parallel dual spindle Package Singulation A parallel dual design unique to DISCO Featuring parallel dual-spindles, ...

A space-saving solution for Φ300 mm dicing Φ300 mm Facing dual spindle 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized ...

Supports small volume grinding with high precisio Φ200 mm 1 axis, 2 chuck tables Stable, high-precision wafer processing With the integration of devices, wafer manufacturing ...

Supports advancements for thinner wafers Φ200 mm 2 axes, 3 chuck tables Wafer Thinning Thin grinding (<100 µm) Advanced handling systems and design features facilitate high yield ...

Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is ...