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DFL7160

Back to: Laser Saws

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Supports various applications, including full cut and DAF cut
Φ300 mm
Ablation

  • DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing.
  • This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG.
  • Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism.
    *A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface


Product Classification

 Adoption of a short pulse laser
Achieves high-quality processing with less processing distortion and deformation due to heating.

 

Compatibility with various applications
DFL7160 also supports applications for removing TEG on low-k grooves or streets and performing full cut for Si and compound semiconductors.

 

Kerf check function
Automatically checks and adjusts the laser cut position. This function is installed as a standard specification, making it possible to achieve stable processing.