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DFM2800

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Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning

Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and remove the front side protection tape in a stable process. It also supports the attachment of DAF with integrated dicing tape, which is necessary for next-generation SiP (System in Package) manufacturing.




Product Classification

Supports ultrathin wafers less than 25 μm thick

To support the thinning requirements of Φ300 mm wafers less than 25 μm thick, the breakage risk of ultra-thin wafers is minimized by reducing the number of wafer handling steps to only twenty percent that of the existing model. In addition, a cleaning mechanism has been installed at each handling pad/table to prevent wafer breakage caused by particle intrusion.

 

 

High throughput

By optimizing each transfer section, an approximate 50% increase* is realized in the maximum throughput for continuous operation. This greatly contributes to an improvement in productivity. (Compared to the DFM2700)

*The actual throughput depends on the wafer mount process time and surface protection tape peeling time.

High throughput
 
 

 

Robust options to support various needs

  • Robot/single load port unit when using the DFM2800 as a stand-alone unit
  • Internal precut mechanism for dicing tape
  • Surface protective tape peeling mechanism using adhesive tape
  • Wafer surface ID recognition mechanism (vision system) for barcode control after wafer mounting

 

 

Easy operation

While the equipment operation method is inherited from the DFM2700, the screen size is larger with better visibility to for a user-friendly and easy to understand operational environment. Furthermore, in an in-line system with a DGP8761, the DFM2800 is even easier to use because of unified management, which makes recipe selection and start/stop on the DFM2800 possible from the DGP8761.

 

Work Flow System

 

 

Work Flow System

  1. Workpiece reception from the grinder →
  2. UV irradiation to the front side protection tape on the workpiece (when the UV tape is used) →
  3. Workpiece transfer to the inspection table (when inspection is needed) →
  4. Alignment using image processing →
  5. Workpiece mounting with dicing tape or 2 in 1 DAF tape →
  6. Surface protective tape peeling from the workpiece →
  7. Tape frame storage (with mounted workpiece) in the cassette
 

 

 

 

 *Product appearance, features, specifications, and other details may change due to technical modifications.
*Please read the standard specification sheet thoroughly before use.