ZHRF Series
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Prevents slant and wavy cutting due to increased blade rigidity
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 blades. The ZHRF series minimizes blades slant cutting and achieves stable processing results even under high load conditions such as high speed processing, thick wafer cutting, or when cutting wafers with a large amount of metal on the streets. In addition, by combining ZHRF blades with laser grooving to process wafers with low dielectric constant (Low-k) layers, backside chipping and peeling are eliminated, and high speed processing is possible.
Electroformed bond
Applications: Silicon wafer, etc
By employing new technologies, the blade strength is improved compared to ZH05 blades. The ZHRF series minimizes blades slant cutting and achieves stable processing results even under high load conditions such as high speed processing, thick wafer cutting, or when cutting wafers with a large amount of metal on the streets. In addition, by combining ZHRF blades with laser grooving to process wafers with low dielectric constant (Low-k) layers, backside chipping and peeling are eliminated, and high speed processing is possible.
- Shows stable processing performance in high load processing.
- Realizes high speed wafer cutting after laser grooving.
- Supports processes that require large blade exposure.
Experimental Data
The ZHRF Series better controls slant cutting even under high processing loads and enables more stable processing compared to the previous blade series due to the improved blade strength.
Blade Strength Comparison
Compared to the previous series, the ZHRF Series shows improved strength
Slant Cut Amount Comparison
Specification
Precision Processing Tools Process Correlation Chart and Trouble Support
When ordering
Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.
To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:
- USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
- DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
- FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
- DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
- Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
- READ the operation manual of the cutting/grinding equipment before use.
- DO NOT USE the precision tooling with modified or customized equipment.
- DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
- DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
- Always USE water or coolant to prevent precision tooling damage.