fbpx

ZHFX Series

Back to: Dicing Blades

Availability: Product not in stock!

Achieves continuous, high-quality processing of oxide wafers

Electroformed bond
Applications: Oxide wafers (LiTaO3, etc.), etc

The ZHFX Series employs a bond that has ideal wear properties for processing newly developed oxide wafers. It is capable of continuously processing oxide wafers, which has been difficult thus far, with a high level of stability. In addition, greater processing stability can be expected in the DBG processing of Lithium Tantalite wafers.

  • Realizes high level and stable processing of oxide wafers.
  • Significantly lowers dress frequency during processing and shows high continuous processing performance.



Product Classification

Lithium Tantalite wafers process example

 

Specification

 

Specification

 

 

Precision Processing Tools Process Correlation Chart and Trouble Support

When ordering

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.

 

To use these DISCO blades and wheels (hereafter precision tooling) safely...

Please read carefully and follow the instructions below to prevent any accidents or injuries:

  • USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
  • DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
  • FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
  • DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
  • Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
  • READ the operation manual of the cutting/grinding equipment before use.
  • DO NOT USE the precision tooling with modified or customized equipment.
  • DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
  • DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
  • Always USE water or coolant to prevent precision tooling damage.