Disco-DFG8640

Mechanisms for high-precision grinding

A spindle axis with high rigidity, low vibration, and less rotation speed fluctuation has been installed to achieve high-precision, high-quality processing. For the chuck table axis, an air bearing unit with high rigidity, low vibration, low heat expansion, and less rotation speed fluctuation has been installed.

Improved usability

The new GUI (graphical user interface), which enables intuitive operations such as tapping and swiping in the same manner as smartphones and tablet devices, offers quick operation from one screen to the target screen without going through other screens.

I

mproved space productivity

The footprint is approx. 13% smaller than DFG8540. In addition, more than 1.2 times as many wafers as DFG8540 can be transferred by reducing the cleaning mechanism operation time and redesigning the transferring arm.

1. The robot pick removes the workpiece from the cassette and places it on the positioning table, where centering takes place.
2. Transfer arm 1 positions the workpiece on the chuck table.
3. The workpieces are ground at Z1 and Z2.
4. Transfer arm 2 removes the workpiece from the chuck table and positions it on the spinner table.
5. Cleaning and drying
6. The robot pick returns the workpiece to the cassette