DFL7361
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Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls cutting waste because only a subsurface layer is processed. This is suitable for workpieces that are vulnerable to contamination.
• A dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.
• Extremely narrow kerf widths allow significant reductions in street width.
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls cutting waste because only a subsurface layer is processed. This is suitable for workpieces that are vulnerable to contamination.
• A dry process that does not require cleaning, suitable for applications (such as MEMS) that are vulnerable to mechanical load.
• Extremely narrow kerf widths allow significant reductions in street width.
Environmental Conditions:
- Use clean, oil-free air (dew point between -10 - -20 , residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
- Keep room temperature fluctuations within ±1℃ of the set value. (Set value should be between 20 - 25 ℃).
- Keep cutting water and cleaning water 2 ℃ above room temperature (fluctuations within ±1 ℃).
- The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
- This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
- All pressures specified above are gauge pressures.
- As the above specification may change due to technical modifications. Please confirm when placing your order.
- For further information, please contact your local sales representative.
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