FM-2246 / 2248 /2243
Back to: Manual Wafer Mounter
Technovision Inc.
This manual wafer mounter series supports three different sizes of workpieces: 300 mm, 200 mm, and 150 mm.
These manual wafer mounter models can be manufactured for either dicing film lamination or back grind film lamination.
• Quick mounting without air bubbles
• Equipped with horizontal and circular cutters to remove unused film
• Equipped with automatic separator film take-up unit
• Three variations, 150mm (6”), 200mm (8”), 300mm (12”)
This manual wafer mounter series can be used for the application of not only wafers but also packaging, glass, ceramic, and various other types of workpieces, and can also be customized to meet special user specifications.
A twin type wafer mounter is also available. With this special model, you can simultaneously set two tapes or films, such as a normal adhesive tape and a UV tape, on a single wafer mounter. This eliminates the need to change tapes.
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