StayClean-R
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Disco
Prevents Corrosionby DI water
The active component in StayClean-R continuously attaches itself to the surface of the metallic layer (e.g. bonding pads), reducing incidences of corrosion-causing contact between the DI water and the metallic layer.
Pad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large diameter, corrosion may occur on the bonding pad due to prolonged exposure to the cutting water. By using StayClean-F, it prevents corrosion due to the formation of an ultra-thin barrier layer on the surface of the workpiece.
Can Be Used in Combination with a DI Water Recycling Unit
The molecular size of the active component in StayClean-R is smaller and better optimized for ion-exchange resin. It also enables ion-exchange and ion-removal, which is necessary for producing DI water. Thus, it conserves water while preventing corrosion, and it is also compatible with the DWR series
Reduced Bonding Pad Defects
StayClean-R exhibits a high corrosion prevention ability, even when diluted up to a maximum of 1:10,000, preventing corrosion during lengthy-processing at a low cost. StayClean-R also excels in cleaning performance, with no concerns for residue on the wafer.
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