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DAD3220
Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
DAD323
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
DAD3230
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
DAD3240
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
DAD3350
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
DAD3360
Φ300 mm manual dicer to meet a variety of needs
Φ300 mm
Single spindle
Exceptional processing flexibility
While offering an even more compact footprint than the existing ...
DAD3430
Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
DAD3650
Ultra compact dual-spindle automatic dicing saw
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness ...
DAD3660
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
DFG8830
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
DFM2800
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
DGP8761
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
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