Dicing Saw for 6 × 6-inch Workpieces Designed for Compactness
Φ150 mm
Single spindle
Compatible with 6 × 6-inch Workpieces Using a User-Specified Specification
Single-axis dicing ...
World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components
Φ150 mm
Single spindle
Diversified Processes
The DAD323 is a ...
Compact Dicing Saw for Φ6-inch Workpieces with Superior Expandability
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified Specification
Single-axis ...
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces
Φ200 mm
Single spindle
High processability
Adoption of a 1.8 kW high-output spindle enables the processing ...
Flexibility for diverse processing needs
Φ200 mm
Single spindle
Supports a wide range of applications
DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...
Φ300 mm manual dicer to meet a variety of needs
Φ300 mm
Single spindle
Exceptional processing flexibility
While offering an even more compact footprint than the existing ...
Φ6-inch Compact Dicing Saw Which Achieves High-Precision, High-Quality Processing
Φ150 mm
Single spindle
Compatible with 6 x 6-inch Workpieces Using a User-Specified ...
Ultra compact dual-spindle automatic dicing saw
Φ200 mm
Facing dual spindle
Small footprint
The optimal design of the DAD3650 combines high functionality and ultra compactness ...
Dual spindle automatic dicing saw for large packaging substrates
Φ300 mm
Facing dual spindle
Package Singulation
Support for workpiece sizes up to 360 × 360 mm
By selecting a ...
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
Realizes faster processing of ultrathin wafers
Φ300 mm
DBG
SDBG
Wafer Thinning
Realizes high yield thin wafer processing
The DFM2800 is a specialized wafer mounter for inclusion ...
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...