Flexibility for diverse processing needs Φ200 mm Single spindle Supports a wide range of applications DAD3350 is capable of handling a maximum of Φ8-inch or 250 x 250 mm ...

World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Φ150 mm Single spindle Diversified Processes The DAD323 is a ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...

Ultra compact dual-spindle automatic dicing saw Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness ...

Flagship model for Φ300 mm wafers with high process extensibility Φ300 mm Facing dual spindle DBG Compatible with both frame and two-way*(frame/wafer) transferring Various ...