Intuitive operation
The LCD panel allows touch operation of the alignment teach function. Important data, such as the equipment condition and mean time between assists (MTBA) is also displayed on screen, allowing the operator to easily confirm the status of the equipment. Onscreen error recovery assistance is also available.

Thorough options for particle prevention
Users can select optional particle prevention measures used in other models, such as the cut section atomizing nozzle and spinner atomizing nozzle. A chuck table water curtain, which prevents particle adhesion caused by wafer drying, is also available.

Improved throughput
A thin wheel cover was adopted and the distance between the blades was reduced, leading to an increase in the number of lines that can be cut simultaneously.Thus cut time is reduced by a maximum of approximately 10 %. (compared to the DFD6362).

Concentrated maintenance area
All operations, from routine to maintenance, can be performed from the front of the equipment. The space reduction achieved in the DFD6560 allows 5 units to be lined up in a space which would only fit 4 units for the DFD6362 at a production facility.

DFD6560 operation flow 

1. Push-pull arm moves the workpiece from the cassette to the pre-alignment stage
2. After centering at the pre-alignment stage, the lower arm moves the workpiece to the chuck table.→
3. Cutting →
4. Upper arm moves the workpiece to the spinner table →
5. Cleaning and drying → Lower arm moves the workpiece to the pre-alignment stage →
6. Push-pull arm returns the workpiece to the cassette.