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DDS2010
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DDS2010

High yield and high throughput separation of small die processed with Stealth Dicing™ Φ200 mm SDTT Reliable separation of small die wafers The DDS2010 offers an integrated ...
DDS2300
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DDS2300

Die separator for high-precision DAF separation Φ300 mm SDBG SDTT Improves the cut quality of thin wafers with DAF In separation process for thin wafers with DAF (Die Attach ...
DAW4110
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Disco-DAW4110

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...
2310
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Disco-DDS2310

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...
DP-F05 Series
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DP-F05 Series


DP08
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DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Gettering DP1
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Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...

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