fbpx
Image
Sort by
Sorted product name -/+
Results 1 - 12 of 15
b1_a
b1
Quick View
Product Classification

B1A Series

Realizes precise processing of difficult to cut materials based on superior wear resistance and rigidity
Metal bond Applications: Electronics components, Optical devices, Various types of ...
DAS8920
Quick View
Product Classification

DAS8920

Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface ...
DAS8930
Quick View
Product Classification

DAS8930

Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFG8830
Quick View
Product Classification

DFG8830

Grinder for thinning difficult-to-process materials Φ150 mm 4 axes, 5 chuck tables Support for the grinding of hard and brittle materials This equipment is suitable for grinding ...
DFM8200
Quick View
Product Classification

DFM2800

Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion ...
DFS8910
Quick View
Product Classification

DFS8910

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8960
Quick View
Product Classification

DFS8960

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
8761
Quick View
Product Classification

DGP8761

High-efficiency grinder/polisher for Φ300 mm wafers Φ300 mm 3 axes, 4 chuck tables DBG SDBG Wafer Thinning Stress Releaf Realizes improvements in process stability and higher ...
p1a_series
Quick View
Product Classification

P1A Series

With an emphasis on cutting performance, this blade provides high processing quality for difficult-to-cut materials
Resin bond Applications: Glass, Crystal, Quartz, LiTaO3, Various types of ...
z05_2
Quick View
Product Classification

R07 Series

Realizes high-grade cutting of various hard, brittle materials with a wide range of bonds
Resin bond Applications: Glass, Quartz, Ceramics, etc A bond material optimal for the characteristics ...
tm11series
Quick View
Product Classification

TM11 Series

Metallic blades that realize higher rigidity
Improved blade rigidity By employing a high-rigidity bond, the TM11 series ...
VT07_12SERIES
VT07_12SERIES_1
Quick View
Product Classification

VT07/12 Series

Vitrified bond blade for high-load processing
The VT07/12 series can handle various materials from processing of difficult-to-cut ...
Page 1 of 2

Mobile Menu