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DAG810
Automatic grinder to respond to new processing needs
Φ200 mm
1 axis, 1 chuck table
Simple and compact single-axis grinder
The DAG810 is a compact, automatic grinder for workpieces ...
DFG8340
Supports small volume grinding with high precisio
Φ200 mm
1 axis, 2 chuck tables
Stable, high-precision wafer processing
With the integration of devices, wafer manufacturing ...
DFG8540
Supports advancements for thinner wafers
Φ200 mm
2 axes, 3 chuck tables
Wafer Thinning
Thin grinding (<100 µm)
Advanced handling systems and design features facilitate high yield ...
DFG8560
Supports advancements for thinner and larger wafers
Φ300 mm
2 axes, 3 chuck tables
DBG
Wafer Thinning
Inherited grinding specifications with an established reputation
DFG8560 is ...
DFG8830
Grinder for thinning difficult-to-process materials
Φ150 mm
4 axes, 5 chuck tables
Support for the grinding of hard and brittle materials
This equipment is suitable for grinding ...
DGP8761
High-efficiency grinder/polisher for Φ300 mm wafers
Φ300 mm
3 axes, 4 chuck tables
DBG
SDBG
Wafer Thinning
Stress Releaf
Realizes improvements in process stability and higher ...
Disco-DFG8640
Pursuing high-precision grinding of various workpieces
Φ200 mm
2 axes, 3 chuck tables
DBG
High-precision grinding
High-precision grinding has been required for power devices and ...
NBC-ZH Series
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
ZH05 Series
Provides stable processing through high-accuracy concentration control
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), ...
ZH14 Series
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...
ZHCR Series
Provides stable processing through increased blade edge deformation resistance
Electroformed bond
Applications: Silicon wafer, etc
For relatively thick blades in excess of 60 ...
ZHDG Series
Electroformed hub blades producing high quality substrate dicing
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
Electroformed bond Applications: Chip LED board, Various types of semiconductor packages, etc The ZHDG series developed for ...
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- +63 908 887 4217
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- info@aurotech.com
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