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NBC-ZH Series

Back to: Dicing Blades

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Achieves high productivity and superb dicing results through excellent dicing performance and long life

Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Oxide wafers (LiTaO3, etc.), etc

A combination of an ultrathin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. In combination with DISCO’s vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.

● Reduces blade breakage and wavy cutting for thin kerfs.
● Enables stable processing of narrow streets.
● Ultrathin 10 µm hub blade.

Product Classification
  • Realizes advanced dicing processes bevel and step cutting
  • Wide range of grit sizes and bond types to support various application requirements
  • Easy to handle ultra-thin blades
  • Shorter blade change time for increased productivity

 

Experimental Data

 

Photographs of Processed Grooves

 

  • Realizes advanced dicing processes bevel and step cutting
  • Wide range of grit sizes and bond types to support various application requirements
  • Easy to handle ultra-thin blades
  • Shorter blade change time for increased productivity

 

 


 
 

Specification:

 

Standard Type

Standard Type

 

Actual blade thickness

Actual blade thickness

 

 

Precision Processing Tools Process Correlation Chart and Trouble Support

When ordering

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity.
When you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specifications.
We are ready to help you to determine which is our most appropriate product type for your application.
* Due to improvements in our products, it is possible that product specifications may be changed without advanced notice.
Please confirm the product specifications with a DISCO representative.

 

To use these DISCO blades and wheels (hereafter precision tooling) safely...
Please read carefully and follow the instructions below to prevent any accidents or injuries:

  • USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury.
  • DO NOT EXCEED the specified rpm limit indicated on the precision tooling.
  • FOLLOW the instruction manual of the equipment to mount the precision tooling properly.
  • DO NOT DROP OR HIT the precision tooling. This may cause breakage or injury.
  • Always CHECK the precision tooling for chipping or any other damage before starting to use it. DO NOT USE the tooling if there is any damage.
  • READ the operation manual of the cutting/grinding equipment before use.
  • DO NOT USE the precision tooling with modified or customized equipment.
  • DO NOT USE precision tooling that has a different size from the one recommended for your equipment.
  • DO NOT USE the precision tooling for any other purpose than grinding, cutting, or polishing.
  • Always USE water or coolant to prevent precision tooling damage.

 

 

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