Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
HogoMax Series
Water-soluble protective film for laser processing
Highly purified water-soluble protective film for semiconductor processes
- HogoMax is a water-soluble resin that prevents particles from ...
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding ...
Achieves high productivity and superb dicing results through excellent dicing performance and long life
Electroformed bond
Applications: Silicon wafer, Compound semiconductor wafers (GaAs, GaP, ...
Achieves high-quality processing through backgrinding
Applications: Silicon wafer, etc
Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in ...
Prevents pad corrosion during dicingPad corrosion prevention
For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc
UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...
Adoption of the newly developed and highly rigid V1 bond to realize stable processing under high load conditions
Electroformed bond
Applications: Silicon wafer, Compound ...