Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
High yield and high throughput separation of small die processed with Stealth Dicing™
Φ200 mm
SDTT
Reliable separation of small die wafers
The DDS2010 offers an integrated ...
Die separator for high-precision DAF separation
Φ300 mm
SDBG
SDTT
Improves the cut quality of thin wafers with DAF
In separation process for thin wafers with DAF (Die Attach ...
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Fine non-thermal curvilinear cutting
Supports other workpiece sizes
Cuts workpieces using pressurized water and abrasives
Through original technology developed to premix and ...
Die separator for small-die wafers
Φ300 mm
SDBG
SDTT
Achieves stable separation for small die after Stealth Dicing™ process
DDS2310 achieves high-quality die separation for ...