Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Ablation Process
A processing method utilizing high-intensity laser irradiation in brief intervals to perform cutting.
• Little to no heat damage to the workpiece.
• ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Stealth Dicing
A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander.
• Controls ...
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si
• Φ300 mm • Stealth Dicing™ • SDBG • SDTT
Realizes optimum wheel life by employing a new bas
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The newly developed GF01 Series in-feed grinding wheels ...
High performance grinding wheel that provides a stable surface finish
Applications: Silicon wafer, Compound semiconductor wafers, Electronics components, etc
The IF Series in-feed grinding ...