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DFL7341
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DFL7341

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT
  • DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
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DFL7360FH

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7361
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DFL7361

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7560L
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DFL7560L

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off
  • Laser Lift-off is a technology used to detach the material layer from the ...
dfl_7362
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Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
  • DFL7362 is a ...

Head Office

Clark Office

  • Office Center 06N Bertaphil Clark Center, Jose Abad Santos Avenue, CFZ, 2009 Angeles City, Philippines
  • +639688918656

Baguio Office

  • Lot 14, Block 10, Pinesville Subdivision, Brgy. Kias, Loakan Road, 2600, Baguio City, Philippines
  • +63 (74) 447 3875

Cebu Office

  • Unit 2H BF Mactan Strip II M.L. Quezon Ave., Brgy. Pajo, Lapu-Lapu City 6015, Philippines
  • +63 (32) 2601830

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