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Blade breakage sensor6
Product Classification

Blade breakage sensor

Processing is stopped immediately if blade breakage occurs to minimize potential workpiece damage.

cc_filter
Product Classification

CC Filter Unit

Unique filter design for low filtration running costs Designed for use next to a dicing saw Ultra-small footprint filtration system This unit recycles dicing/grinding water and ...
C02_injector
Product Classification

CO 2 Injector

High quality processing through direct link to dicing saw Workpiece charging significantly reduced The CO2 Injector lowers the resistivity of purified water by dissolving carbon ...
dcs1440priod
Product Classification

DCS1440

Manual cleaning system for Φ8-inch wafers with enhanced cleaning performance The DCS1440 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
1441
Product Classification

DCS1441

Spin cleaning and drying for workpieces processed using dicing saws Manual cleaning system with enhanced cleaning performance The DCS1441 is the optimal solution for cleaning and ...
DCS1460
Product Classification

DCS1460

Manual cleaning system for Φ300 mm wafers with enhanced cleaning performance The DCS1460 is used to clean workpieces that have been cut on a dicing saw. Cleaning sequences can be created easily (the ...
DFL7341
Product Classification

DFL7341

Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm    Stealth Dicing™   SDBG   SDTT
  • DFL7341 is a fully automatic laser saw for Φ8-inch ...
DFL7360FH
Product Classification

DFL7360FH

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7361
Product Classification

DFL7361

Stealth Dicing A processing method that focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. • Controls ...
DFL7560L
Product Classification

DFL7560L

Laser Lift-Off Equipment with Wide Process Margin using DPSS Laser Φ150 mm Laser Lift-off
  • Laser Lift-off is a technology used to detach the material layer from the ...
dfl_7362
Product Classification

Disco-DFL7362

Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si • Φ300 mm • Stealth Dicing™ • SDBG • SDTT
  • DFL7362 is a ...
DTU1550
Product Classification

DTU1550

Next generation water temperature control unit which has improved cooling efficiency and water supply capacity Stable High Precision Processing DTU1550 is a water supply unit for ...
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