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cassette_frames
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Cassette and tape frame

High precision products to facilitate stable production from tape mounter to die bonder. Meets the ø300 mm wafer SEMI standard.

DAS8920
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DAS8920

Semi-automatic surface planer for Φ8-inch wafers Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO surface ...
DAS8930
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DAS8930

Semi-automatic surface planer for Φ300 mm wafers
Φ300 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8910
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DFS8910

Fully-automatic surface planer for Φ8-inch wafers
Φ200 mm 1 axis, 1 chuck table Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DFS8960
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DFS8960

Fully-automatic surface planer for Φ300 mm wafers
Φ300 mm 2 axes, 2 chuck tables Planarization Ultrahigh-precision planarization technology using a diamond bit The DISCO ...
DP-F05 Series
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DP-F05 Series


DP08
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DP08 Series

Chemical-free stress relief dry polishing wheel| In addition to wafer polishing in the conventional grinding process, the DP08 realizes ...
Gettering DP
Gettering DP1
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Gettering DP

Dry polishing wheels that achieve high die strength while maintaining gettering performance
Applications: Silicon wafer, etc Due to the ultra-thinning of wafers, loss of gettering performance ...
hogo
hogomax
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HogoMax

HogoMax Series Water-soluble protective film for laser processing Highly purified water-soluble protective film for semiconductor processes - HogoMax is a water-soluble resin that prevents particles from ...
stayclean-F
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StayClean-F

Prevents pad corrosion during dicing Pad corrosion prevention For workpieces that have a long cut time, such as a workpiece with a small die size and a large ...
200 mm Wheel Guard
300 mm Wheel Guard
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Wheel Guard

Protects wheel segments for streamlined wheel replacement and easier handling.


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