Model: UVC-300A for up to 12” UV-LED models which have a long life and low running cost are cassette to cassette fully automatic system and 200mm (8”) manual and 300mm (12”)

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Achieves both high die strength and gettering performance using ultra-fine diamonds
Applications: Silicon wafer, etc UltraPoligrind employs an ultra-fine diamond abrasive to create higher die ...

Prevents slant and wavy cutting due to increased blade rigidity Electroformed bond Applications: Silicon wafer, etc By employing new technologies, the blade strength is improved compared to ZH05 ...

Fine non-thermal curvilinear cutting Supports other workpiece sizes Cuts workpieces using pressurized water and abrasives Through original technology developed to premix and ...

Die separator for small-die wafers Φ300 mm SDBG SDTT Achieves stable separation for small die after Stealth Dicing™ process DDS2310 achieves high-quality die separation for ...

Dual spindle automatic dicing saw for large packaging substrates Φ300 mm Facing dual spindle Package Singulation Support for workpiece sizes up to 360 × 360 mm By selecting a ...

Ultra-compact Dual Spindle Dicing Saw Which Achieves Increased Processing Stability Φ200 mm Facing dual spindle Small footprint The optimal design of the DAD3651 combines high ...

Adopted an air slide on the X-axis to support high precision processing needs Φ150 mm Single spindle Able to support wide range of applications Supports workpieces up to Φ6-inch ...

Standard manual dicing saw for Φ8-inch workpieces Φ200 mm Single spindle High processability Improved throughput through the introduction of servo motors on all axes (X, Y, and ...

Evolved Compact Dicing Saw Φ150 mm Single spindle Focus on Functionality and Expandability DAD3231, designed for high performance and expandability, just like the conventional ...

Evolved Compact Dicing Saw Φ150 mm Single spindle Compatible with Diverse Small Workpiece Processing Needs DAD3221 is a single-axis dicing saw which achieves processing of ...